MUMBAI, India, Aug. 22 -- Intellectual Property India has published a patent application (202411010139 A) filed by Teerthanker Mahaveer University, Moradabad, Uttar Pradesh, on Feb. 14, 2024, for 'electronic circuit cover manufacturing device.'
Inventor(s) include Pankaj Kumar Goswami.
The application for the patent was published on Aug. 22, under issue no. 34/2025.
According to the abstract released by the Intellectual Property India: "An electronic circuit cover manufacturing device comprising a platform 1 positioned on ground surface, with multiple wheels 3 for movement, platform 1 features a chamber 4 for storing scrap-plastic bottles, with an inlet 5 for bottle insertion, a display panel 6 allows user to input circuit dimensions, allowing an microcontroller to determine required bottle type, a robotic gripper 7 retrieves determined bottle and places bottle into a furnace 8 for heating, another gripper 9 withdraws heated bottle, while a motorized cutter 10 cuts the bottle into a long strip with motorized rollers 11 rotate the bottle for strip cutting, a spool 12 configured with a heating unit 13 to melt and softening the bottle, a third robotic gripper 14 feeds melted strip to a designing unit 15, an electronic nozzle 16 in designing unit 15 dispenses molten strip on a plate on the platform 1 to fabricate the circuit cover."
Disclaimer: Curated by HT Syndication.
