MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202441095752 A) filed by Samsung Electronics Co. , Ltd on January 22, 2025, for “releasing And Adding Dual Connectivity”.
Inventor includes Aby Kanneath Abraham.
The application for the patent was published on July 24, 2026, under issue no. 30/2026.
Abstract: ABSTRACT “RELEASING AND ADDING DUAL CONNECTIVITY” The present invention discloses a method and a user equipment (UE) (200) for releasing and adding dual connectivity. The method includes receiving by UE (200) an MR-DC configuration from a network apparatus and determining by the UE (200) whether an MR-DC release is triggered by reception of MR-DC release and add configuration from the network apparatus. Further, the method includes performing by the UE (200) one of releasing the other configuration associated with the SCG except the SPR configuration configured by source PSCell upon the release of the MR-DC when the MR-DC release is triggered due to the reception of the MR-DC release and add configuration from the network apparatus and releasing the other configuration associated with the SCG and releasing the SPR configuration configured by the PCell when the MR-DC release is not triggered due to the reception of the MR-DC release and add configuration from the network apparatus. FIG. 3
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