MUMBAI, India, July 30 -- Intellectual Property India has published a patent application (202421090163 A) filed by Huliot Pipes & Fittings Private Limited on November 20, 2024, for “swept Core System Assembly For Injection Moulding”.
Inventor includes Guy Machlof.
The application for the patent was published on July 24, 2026, under issue no. 30/2026.
Abstract: ABSTRACT Swept Core System Assembly for Injection Moulding Described herein is swept core system assembly comprising a swept core body mechanism and a core head mechanism. The swept core body mechanism comprises a linear movement profile and the core head mechanism comprises a tilted movement profile. Dividing the swept core body mechanism movement into two stages (linear and tilted core head movement) enables to reduce the swept operating sector. In other words, the tilted movement profile of the core head mechanism allows a reduced swept movement of an operating sector of the swept core system assembly. Refer Figure 1(a)
Disclaimer: Curated by HT Syndication.
