MUMBAI, India, Feb. 27 -- Intellectual Property India has published a patent application (202631015047 A) filed by National Institute Of Technology, Patna, Bihar, on Feb. 11, for 'a copper plate thermal management device with semicircular microchannels.'
Inventor(s) include Anand Kumar; and Om Prakash.
The application for the patent was published on Feb. 27, under issue no. 09/2026.
According to the abstract released by the Intellectual Property India: "The present invention pertains to a copper plate thermal management device (10) for efficient cooling of electronic components. The device comprises a copper base plate (1) configured to receive heat from an electronic component mounted thereon. A plurality of parallel microchannels (2) are formed on an upper surface (1A) of the copper base plate (1), each microchannel (2) having a semicircular cross-section and extending between a first end (2A) and a second end (2B). An inlet manifold (3) is integrally formed within the copper base plate (1) and is fluidly connected to the first ends (2A) of the microchannels (2) to supply a coolant, while an outlet manifold (4) is fluidly connected to the second ends (2B) of the microchannels (2) to discharge the heated coolant. The device (10) provides uniform heat dissipation, improved thermal performance, and suitability for high-power-density electronic applications."
Disclaimer: Curated by HT Syndication.
