MUMBAI, India, Sept. 26 -- Intellectual Property India has published a patent application (202518084685 A) filed by Seoul Viosys Co. Ltd., Gyeonggi, Republic of Korea, on Sept. 6, for 'a light emitting device package.'
Inventor(s) include Jang, Jong Min; and Kim, Chang Yeon.
The application for the patent was published on Sept. 26, under issue no. 39/2025.
According to the abstract released by the Intellectual Property India: "A light emitting device package comprising: a substrate having a plate shape with a front surface and a rear surface formed of a light transmissive insulating material; at least one light emitting device disposed on the front surface of the substrate and configured to emit light in a direction toward the front surface; and a molding layer disposed on the substrate and surrounding the light emitting device, wherein the light emitting device includes: a light emitting structure disposed on the substrate; a multi-layered insulation layer disposed on the light emitting structure, and including a first insulation layer and a second insulation layer; and a plurality of bump electrodes disposed on light emitting structure and including a first bump electrode and a second bump electrode, wherein the light emitting structure includes: a first epitaxial stack on the substrate a second epitaxial stack disposed on the first epitaxial stack; and a third epitaxial stack disposed on the second epitaxial stack, wherein the first insulation layer is disposed on the light emitting structure and includes a patterned removed region that is configured to expose the first epitaxial stack for connecting with the first bump electrode, and wherein the molding layer includes a region having a thickness less than 100 micrometers in height form the rear surface."
The patent application was internationally filed on Mar. 19, 2020, under International application No.PCT/KR2020/003743.
Disclaimer: Curated by HT Syndication.
