MUMBAI, India, Sept. 12 -- Intellectual Property India has published a patent application (202411013979 A) filed by Indian Institute Of Technology Delhi; and Giva, New Delhi, on Feb. 27, 2024, for 'a method for electroplating an alloy and composition thereof.'
Inventor(s) include Jain, Jayant; Gosvami, Nitya Nand; Bhowmik, Ayan; Singh, Chetan; and Agarwal, Ishendra.
The application for the patent was published on Sept. 12, under issue no. 37/2025.
According to the abstract released by the Intellectual Property India: "The present disclosure generally relates to the field of electroplating of metals. Particularly, the present disclosure relates to a method for electroplating an alloy, comprising: blending manganese with a silver-based alloy to obtain a blended metal; and electroplating a surface of the blended metal to obtain an electroplated alloy. The present disclosure also relates to an electroplated alloy composition comprising: silver in a range of 91.5 to 93.5 (wt/wt)%; copper in a range of 2.5 to 4.5 (wt/wt)%; manganese in a range of 1 to 6 (wt/wt)% and zinc in a range of 0.5 to 1.5 (wt/wt)%. The present disclosure generally relates to the field of electroplating of metals. The method improves the quality, adhesion, and durability of rose gold plating on metals."
Disclaimer: Curated by HT Syndication.
