MUMBAI, India, Nov. 14 -- Intellectual Property India has published a patent application (202441037158 A) filed by University Of Hyderabad, Hyderabad, Telangana, on May 10, 2024, for 'a method for producing bi-2223 superconductor supporting high current density.'
Inventor(s) include Dr. Seshu Bai Vummethala; Dr. Rajasekharan Thankappan Pillai; Pawan Kumar Verma; and Dr. Srinath Sanyadanam.
The application for the patent was published on Nov. 14, under issue no. 46/2025.
According to the abstract released by the Intellectual Property India: "The present invention relates to a method for producing a composite superconductor material. The method involves synthesizing Bi-2223 precursor powder and Ca0.86Sr0.14CuO2 (I-phase) particles, mixing them in various concentrations, dispersion in a premix, tumbling, polymerization, molding, sintering twice at 845 C with intermediate pressing, and characterization through microstructure and magnetic properties analysis. The Bi-2223 precursor powder synthesis includes dissolving Bi2O3, SrCO3, CuO, and CaCO3 powders in concentrated Nitric Acid, followed by drying, grinding, and annealing at 800 C. The I-phase particles synthesis involves combusting metal nitrates with urea, grinding, and annealing at 500 C. The resulting composite material demonstrates enhanced superconducting properties up to 77 K, with optimized distribution and morphology of I-phase particles."
Disclaimer: Curated by HT Syndication.
