MUMBAI, India, Aug. 1 -- Intellectual Property India has published a patent application (202411005741 A) filed by Indian Institute Of Technology, Ropar, Punjab, on Jan. 29, 2024, for 'a multi-purpose test rig for thermal performance evaluation of metallic structures.'
Inventor(s) include Kishore, Hreetabh; Nirala, Chandrakant Kumar; and Agrawal, Anupam.
The application for the patent was published on Aug. 1, under issue no. 31/2025.
According to the abstract released by the Intellectual Property India: "The present invention discloses a multi-purpose test rig for thermal performance evaluation of metallic structures. The test rig powered by constant power supply, comprises upper (2) and lower part (12) in connection with locking nuts (1) provided deep inside the test rig, lower part and upper part sandwiches metallic structures (8). The upper part is provided with heater (20) inside heating block where heat is made to flow only in vertical direction, rest surfaces are insulated. The lower part (12) consists of a fluid flow system for evaluation of thermal characterization during steady and transient flow conditions; and a coolant supply system to maintain the temperature of the lower metallic block. This system facilitates accurate and reliable measurement of thermal performance."
Disclaimer: Curated by HT Syndication.
