MUMBAI, India, June 27 -- Intellectual Property India has published a patent application (202321088413 A) filed by Hitech Corporation Limited, Maharashtra, on Dec. 23, 2023, for 'a pail.'
Inventor(s) include Vaddadhi Sitaram Anjaneyulu.
The application for the patent was published on June 27, under issue no. 26/2025.
According to the abstract released by the Intellectual Property India: "The present disclosure relates to the field of pails, and envisages a pail (100) which comprises a container body (101) defined by a base (102A) and side walls (102B). A plurality of corrugated ribs (103) is configured on an operative inner surface of the side walls (102B) of the container body (101) at a spaced apart distance from each other. The ribs (103) are configured to extend from an operative top edge of the inner surface of the side walls (102B) to a base (102A) of the container body (101). Each rib has a thickness-to-width ratio ranging from 0.01 to 0.03. A lid (108) is removably detachably secured to an open end of the container body (101). A handle (106) is attached to the container body (101)."
Disclaimer: Curated by HT Syndication.
