MUMBAI, India, March 13 -- Intellectual Property India has published a patent application (202641001284 A) filed by Psg Institute Of Technology And Applied Research, Coimbatore, Tamil Nadu, on Jan. 6, for 'a polymeric resin bound composite material developed from electronic waste powder and industrial was.'
Inventor(s) include Dr. Ravi Balaji; Dr. Jaisankar Karthick; Dr. Murugesan Arun; Arumugasamy Senthilkumar; Sivakumar Sudharsan; Venkatesan Surendiran; and Sachiin Rajasheker.
The application for the patent was published on March 13, under issue no. 11/2026.
According to the abstract released by the Intellectual Property India: "The present invention relates to a polymeric resin-bound composite material and a scalable manufacturing process utilizing electronic waste printed circuit board powder in combination with industrial wastes such as fly ash, waste foundry sand, red mud, and shredded plastic waste. The invention converts non-metallic e-waste fractions and industrial by-products into value-added construction materials including wall panels, tiles, and paver blocks. The composite formulation employs optimized resin-to-waste ratios and controlled curing conditions to achieve high mechanical strength, low water absorption, and improved durability. The developed composites demonstrate significant compressive strengths and offer an environmentally sustainable alternative to conventional construction materials, thereby addressing waste management challenges and promoting circular economy practices in the construction industry."
Disclaimer: Curated by HT Syndication.
