MUMBAI, India, Sept. 26 -- Intellectual Property India has published a patent application (202534022124 A) filed by Taikisha Ltd., Tokyo, on March 12, for 'abrasive separation apparatus and control method for abrasive separation apparatus.'
Inventor(s) include Suzuki, Hiroyuki; and Hasegawa, Chikara.
The application for the patent was published on Sept. 26, under issue no. 39/2025.
According to the abstract released by the Intellectual Property India: "An abrasive separation apparatus (10) comprising: a plate-shaped separation member (40) to be inserted between an attachment portion (21) with an abrasive (22) attached and the abrasive; a control unit (301) configured to relatively move the attachment portion with the abrasive attached and the separation member such that a state is entered where the separation member is inserted between the attachment portion and the abrasive; and an auxiliary separation member (50), that has a plate-shape or is a frame member, located on an opposite side to the attachment portion relative to the separation member in a state where the separation member is inserted between the attachment portion and the abrasive and configured to come into contact with the abrasive whose portion has been separated from the attachment portion."
Disclaimer: Curated by HT Syndication.
