MUMBAI, India, Nov. 14 -- Intellectual Property India has published a patent application (202517069751 A) filed by Telefonaktiebolaget LM Ericsson (PUBL), Stockholm, on July 22, for 'an improved uplink lower layer split supporting advanced comp.'
Inventor(s) include Lu, Chenguang; Berg, Miguel; Karlsson, Jonas; and Huang, Yezi.
The application for the patent was published on Nov. 14, under issue no. 46/2025.
According to the abstract released by the Intellectual Property India: "Methods and systems are described for performing or assisting in joint equalization, DMRS-based joint equalization, or maximum ratio combining. In certain embodiments, the DU requests the RU to send both the equalized DMRS symbols and the equalized data symbols when indicated by a scheduler. The DU can use the equalized DMRS symbols to estimate the effective channel including the equalization done in the RU. Then, the DU performs a joint equalization or DMRS-based joint equalization to the equalized data symbols received from one or more RUs using the effective channel estimates."
The patent application was internationally filed on Apr. 03, 2024, under International application No.PCT/IB2024/053263.
Disclaimer: Curated by HT Syndication.
