MUMBAI, India, June 27 -- Intellectual Property India has published a patent application (202517053480 A) filed by Micro-Composite Inc., Gyeonggi, Republic of Korea, on June 2, for 'aqueous suspension and cutting fluid comprising same.'

Inventor(s) include Choi, Don Chul.

The application for the patent was published on June 27, under issue no. 26/2025.

According to the abstract released by the Intellectual Property India: "The present invention relates to an aqueous suspension and a cutting fluid comprising same. The aqueous suspension comprises: water; hexagonal boron nitride (hBN) particles, which are hydrophilic particles that are wettable in water, and a dispersant, wherein the hexagonal boron nitride particles are uniformly dispersed and remain in a colloidal state for a certain period of time, such that the aqueous suspension exhibits superior cutting performance compared to conventional water-soluble cutting fluids of the O/W emulsion type."

The patent application was internationally filed on Nov. 01, 2023, under International application No.PCT/KR2023/017258.

Disclaimer: Curated by HT Syndication.