MUMBAI, India, Sept. 26 -- Intellectual Property India has published a patent application (202411018185 A) filed by Teerthanker Mahaveer University, Moradabad, Uttar Pradesh, on March 13, 2024, for 'automated copper lug installation device for wire.'
Inventor(s) include Pradeep Kumar Verma.
The application for the patent was published on Sept. 26, under issue no. 39/2025.
According to the abstract released by the Intellectual Property India: "An automated copper lug installation device for wire, comprises of a platform 1 positioned on a ground surface installed with a chamber 2 segregated into multiple sections stored with copper lugs, a touch enabled screen 3 accessed by a user to provide input for installing lugs on a wire, a camera 4 to detect free-end of the wire, multiple motorized omnidirectional wheels 5 to maneuver the platform 1 near wire, a telescopically operated gripper 6 for gripping free-end of wire, a primary robotic arm 7 configured with a ring 8 for cutting insulating cover of wire, a heating unit for binding filaments of conducting part to allow accommodation of conducting part of lug, a laser acuity sensor for detecting diameter of conducting part and a speaker 11 for notifying user regarding successful installation of copper lug."
Disclaimer: Curated by HT Syndication.
