MUMBAI, India, Aug. 29 -- Intellectual Property India has published a patent application (202411010743 A) filed by Teerthanker Mahaveer University, Moradabad, Uttar Pradesh, on Feb. 15, 2024, for 'automated crack repairing device.'
Inventor(s) include Shelendra Pal; and Varun Kumar Singh.
The application for the patent was published on Aug. 29, under issue no. 35/2025.
According to the abstract released by the Intellectual Property India: "An automated crack repairing device, comprising a platform 1 configured with four wheels 2 to move platform 1, a handle 3 over which user applies manual effort for moving platform 1, an artificial intelligence based imaging unit 4 installed on platform 1 to determine crack on surface, a robotic link 5 configured with a motorized grinder 6 assembled on platform 1 for grinding in proximity to crack for levelling of crack, a dust sensor assembled on platform 1 for detecting presence of dust particles, a vacuum based cleaning unit 7 assembled on platform 1 for cleaning dust particles, a chamber 8 assembled on platform 1 for storing an epoxy resin, an electronic nozzle 9 for dispensing resin inside crack, a container 10 assembled on platform 1 for storing sand, and an electronic valve 11 connected with container 10 for dispensing sand over crack in order to properly repair crack."
Disclaimer: Curated by HT Syndication.
