MUMBAI, India, Sept. 12 -- Intellectual Property India has published a patent application (202411012975 A) filed by Chandigarh University; and Chandigarh University Technology Business Incubator, Mohali, Punjab, on Feb. 22, 2024, for 'automated ground surface levelling device.'
Inventor(s) include Pankaj Kumar.
The application for the patent was published on Sept. 12, under issue no. 37/2025.
According to the abstract released by the Intellectual Property India: "An automated ground surface levelling device, comprises of a housing 1 positioned on a ground surface, four motorized omnidirectional wheels 2 arranged on the housing 1 for maneuvering the housing 1 on the ground surface, a touch enabled screen 3 arranged on the housing 1 for enabling a user to give input commands for levelling the ground surface, a camera 4 mounted on the housing 1 for detecting exact location of soil humps on ground surface, a rectangular frame 5 configured with the housing 1 via a pair of L-shaped telescopically operated rods 6 and equipped with a set of plates 7 to extend rods 6 for positioning the frame 5 on the ground surface, a motorized iris lid 8 configured with a chamber 9 mounted on the housing 1 and stored with soil to open for dispensing the soil within the hole in view of filling the hole."
Disclaimer: Curated by HT Syndication.
