MUMBAI, India, Oct. 31 -- Intellectual Property India has published a patent application (202411024017 A) filed by Chandigarh University; and Chandigarh University Technology Business Incubator, Mohali, Punjab, on March 26, 2024, for 'automated object packaging device.'
Inventor(s) include Ankit Verma.
The application for the patent was published on Oct. 31, under issue no. 44/2025.
According to the abstract released by the Intellectual Property India: "An automated object packaging device, comprising a rectangular platform 1 installed with two U-shaped frames 2 via two telescopically operated bars 3 over which user accommodates object as detected by a proximity sensor, an ultrasonic sensor detects user's height and accordingly bars 3 extend/retract for allowing user to easily accesses frames 2, a touch enabled screen 4 accessed by user to initiate packaging object, an artificial intelligence-based imaging unit detects dimensions of object, two motorized sliders 5 translate bars 3 towards/away for accommodating objects on frames 2 in a secured manner, a circular disc 6 installed with one of frames 2 and installed with an L-shaped link 7 attached with a spool 8 wrapped with a wrapping sheet, a telescopically operated gripper engages free-end of sheet with object, a scotch-yoke arrangement 9 rotates link 7 around frames 2 for wrapping over object for packaging object."
Disclaimer: Curated by HT Syndication.
