MUMBAI, India, Nov. 7 -- Intellectual Property India has published a patent application (202411024888 A) filed by Chandigarh University; and Chandigarh University Technology Business Incubator, Mohali, Punjab, on March 27, 2024, for 'automated stamp application device.'
Inventor(s) include Divya.
The application for the patent was published on Nov. 7, under issue no. 45/2025.
According to the abstract released by the Intellectual Property India: "An automated stamp application device comprises a housing 1 configured with motorized omnidirectional wheels, a touch interactive display panel 3 installed over the housing 1 to provide an input, a motorized sliding unit 4 installed at bottom portion of the chamber to provide translation to the plate, a robotic gripper 5 installed within the housing 1 to grip the positioned document and place over a platform 6 arranged within the housing 1, an artificial intelligence-based imaging unit 7 is installed within the housing 1 determines presence of text over the document, an OCR module integrated with the imaging unit to determine text written over the document, a motorized cylindrical member 8 installed within the housing 1 and configured within plurality of containers 9 each developed to accommodate a specific type of stamp, and a motorized door 10 installed over each of the containers opens only a particular door."
Disclaimer: Curated by HT Syndication.
