MUMBAI, India, Sept. 26 -- Intellectual Property India has published a patent application (202517084439 A) filed by Huntsman Advanced Materials (SWITZERLAND) Gmbh, Basel, Switzerland, on Sept. 5, for 'bismaleimide compounds and low dielectric resin composition comprising them.'
Inventor(s) include Storz, Christof; Scobbie, Kenneth Black; Radet, Samara; Elmer, Susanne; and Napoli, Alessandro.
The application for the patent was published on Sept. 26, under issue no. 39/2025.
According to the abstract released by the Intellectual Property India: "Bismaleimide compounds of the formula (I) wherein R1 is a divalent aliphatic radical and R2 is a divalent aromatic radical; And resin compositions comprising said bismaleimide compounds of the formula (I), having a low dielectric constant (Dk), a low dielectric dissipation factor (Df) and a high glass transition temperature (Tg)."
The patent application was internationally filed on Feb. 29, 2024, under International application No.PCT/EP2024/055175.
Disclaimer: Curated by HT Syndication.
