MUMBAI, India, Nov. 14 -- Intellectual Property India has published a patent application (202547077485 A) filed by Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung Eingetragener Verein, Munchen, Germany, on Aug. 14, for 'bonded seam, method, and device for joining material webs or material sheets by means of a thermally activatable adhesive, and use of an impact press.'
Inventor(s) include Kott, Mathias.
The application for the patent was published on Nov. 14, under issue no. 46/2025.
According to the abstract released by the Intellectual Property India: "The invention relates to a bonded seam, a method, and a device for joining material webs (10) by means of a thermally activatable adhesive, in particular a hot-melt adhesive (11), wherein the material webs (10) are joined between impact elements (2, 4) along a bonded seam (12). According to the invention, an impact pulse is applied to the material webs or material sheets (10) which are arranged one above the other between a pair of unheated impact elements (2, 4) and between which the adhesive (11) is located. By means of this process, the bonded seam (12) is formed by the impact pulse penetrating at least in part into the adhesive (11) and the adhesive being activated thereby, with the activation being limited to the region where the bonded seam (12) extends, and with a resulting height of the bonded seam (12) which is lower than the height of both material webs or material sheets (10), and with all the liquefied adhesive (11) being used in the formation of the bonded seam (12) and the region of the liquefied adhesive (11) remaining restricted to the bonded seam (12). The invention also relates to the use of an impact press."
The patent application was internationally filed on Jan. 12, 2024, under International application No.PCT/DE2024/100022.
Disclaimer: Curated by HT Syndication.
