MUMBAI, India, Nov. 7 -- Intellectual Property India has published a patent application (202547096215 A) filed by Takazuri Limited, London, on Oct. 6, for 'building envelope covering systems and components.'
Inventor(s) include Hornor, Christopher; Schlesinger, Maria; and Kassem, Adel.
The application for the patent was published on Nov. 7, under issue no. 45/2025.
According to the abstract released by the Intellectual Property India: "An aspect of the present invention provides a building tile made from a plastic material, having a top surface and a bottom surface and generally comprising a top section and a bottom section, and wherein the top section of the building tile is configured to interlock with the top section of adjacent building tiles in a horizontal row and the bottom section of another building tile positioned above it in a vertical row, and the bottom section of the building tile is configured to interlock with the bottom section of adjacent building tiles in a horizontal row."
The patent application was internationally filed on Mar. 06, 2024, under International application No.PCT/IB2024/052152.
Disclaimer: Curated by HT Syndication.
