MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517038675 A) filed by Fujikura Ltd., Tokyo, on April 22, for 'cable bundle, method of manufacturing cable bundle, and cable bundle manufacturing apparatus.'
Inventor(s) include Maehara, Naoya; Luo, Shengyang; and Namazue, Akira.
The application for the patent was published on June 13, under issue no. 24/2025.
According to the abstract released by the Intellectual Property India: "A cable bundle 1 comprises a plurality of bundle units 10A-10C stacked in a second direction D3 orthogonal to a first direction that is the circumferential direction D1 of the cable bundle 1. The bundle units 10A-10C are respectively provided with first loops 20A-20C and second loops 30A-30C stacked in the second direction D3. The first loops 20A-20C and second loops 30A-30C are connected to each other by using connection parts 12A-12C such that figure-eight-shaped loops comprising the first and second loops are formed when the bundle units are opened. The connection parts 12A-12C of the bundle units 10A-10C that are adjacent in the second direction D3 are offset in the first direction D1."
The patent application was internationally filed on Nov. 20, 2023, under International application No.PCT/JP2023/041683.
Disclaimer: Curated by HT Syndication.
