Intellectual Property India Publishes Patent Application for 'Chip Package With Core Embedded Chiplet' Filed by Advanced Micro Devices, Inc; and Ati Technologies Ulc

MUMBAI, India, Aug. 29 -- Intellectual Property India has published a patent application (202517074461 A) filed by Advanced Micro Devices, Inc; and Ati Technologies Ulc, Santa Clara, U.S.A., on Aug. 5, for 'chip package with core embedded chiplet.'

Inventor(s) include Kulkarni, Deepak Vasant; Naffziger, Samuel; Swaminathan, Raja; Straayer, Matthew; Burkhart, Justin Michael; Boyapati, Sri Ranga Sai; Dhavaleswarapu, Hemanth Kumar; Pfeiffenberger, Alexander Helmut; and Haritsa, Manjunath D.

The application for the patent was published on Aug. 29, under issue no. 35/2025.

According to the abstract released by the Intellectual Property India: "Chip packages are described herein that includes chiplets embedded in a core of a substrate of the chip package, such as a package substrate or an interposer. In one example, the chiplet includes voltage regulation circuitry that is coupled through a substrate core embedded inductor to an integrated circuit (IC) die mounted to the substrate."

The patent application was internationally filed on Jan. 03, 2024, under International application No.PCT/US2024/010222.

Disclaimer: Curated by HT Syndication.