MUMBAI, India, July 25 -- Intellectual Property India has published a patent application (202517064682 A) filed by Nhk Spring Co. Ltd., Kanagawa, Japan, on July 7, for 'coating material, coating layer, and spring.'
Inventor(s) include Matsuda, Tsuyoshi; Kitagawa, Naoyuki; Arisaka, Norihumi; Ibano, Daisuke; and Ito, Chihiro.
The application for the patent was published on July 25, under issue no. 30/2025.
According to the abstract released by the Intellectual Property India: "The present invention pertains to: a coating material that, when being cured, provides an air bubble percentage of 0-50% in a cured product layer; a coating layer; and a spring using the same."
The patent application was internationally filed on Dec. 11, 2023, under International application No.PCT/JP2023/044300.
Disclaimer: Curated by HT Syndication.
