MUMBAI, India, Nov. 7 -- Intellectual Property India has published a patent application (202517041916 A) filed by Robert Bosch Gmbh, Stuttgart, Germany, on April 30, for 'coil assembly.'
Inventor(s) include Walker, Jan; Jacobs, Heiner; Meyer, Moritz; and Tanczos, Gellert.
The application for the patent was published on Nov. 7, under issue no. 45/2025.
According to the abstract released by the Intellectual Property India: "The invention relates to a coil assembly (1) comprising a circuit carrier (2), an electric coil (5), the winding (7) of which is wound around a magnet core (6) and engages through an inner opening (6.1), and a cooling assembly (10), wherein at least two windings (8) each have an electrically conductive conductor piece (8.1) with two end pieces (8.2, 8.3) which are each inserted into an electric via (4) and contacted, wherein the cooling assembly (10) has, on a surface of the circuit carrier (2) facing the coil, in the region of the magnet core (6), a plurality of first line structures (3, 11), which are thermally coupled, via at least one thermal via (12), to a plurality of associated second line structures (13, 14) on a surface of the circuit carrier (2) facing away from the coil, wherein the first line structures (3, 11) are spaced apart from one another and are each connected to at least one of the electric vias (4), and the second line structures (13, 14) are spaced apart from one another and are thermally coupled to at least one cooling element (18) located on the surface of the circuit carrier (2) facing away from the coil, so that in each case one cooling path is formed between the end pieces (8.2, 8.3), which are contacted with the corresponding electric vias (4), of the at least two windings (8) and the at least one cooling element (18)."
The patent application was internationally filed on Apr. 02, 2024, under International application No.PCT/EP2024/058952.
Disclaimer: Curated by HT Syndication.
