MUMBAI, India, July 5 -- Intellectual Property India has published a patent application (202517058971 A) filed by Kuraray Co. Ltd., Okayama, Japan, on June 19, for 'composite multilayer film and multilayer structure including same.'
Inventor(s) include Yoshida, Kentaro; Muramoto, Takuya; Izumi, Yuki; and Ishiuchi, Satoshi.
The application for the patent was published on July 4, under issue no. 27/2025.
According to the abstract released by the Intellectual Property India: "A composite multilayer film comprising: a multilayer film having a layered configuration comprising a layer (X), a layer (Y), and a layer (Z) which adjoin in this order, the layer (X) being an outermost layer; and an inorganic layer (I) and a protective layer (P) which have been disposed on the layer (X) side of the multilayer film. The layer (X) is made of a resin composition (A) including, as a main component, EVOH (a) having an ethylene unit content of 20-50 mol% and a degree of saponification of 90 mol% or higher, the layer (Y) includes, as a main component, an adhesive resin (B) having a melting point lower than 150 C, and the layer (Z) includes, as a main component, a polyolefin resin (C) having a melting point lower than 150 C, the resin composition (A) containing alkali metal ions (b) in an amount of 40-500 ppm. The composite multilayer film contains neither a layer including, as a main component, a resin having a melting point of 200 C or higher nor a metal layer having an average thickness of 1 m or lager. This composite multilayer film has high gas-barrier properties although including a polyolefin having poor heat resistance and a low melting point, such as polyethylene, as a main material and stably exhibits the gas-barrier properties even after laminating."
The patent application was internationally filed on Nov. 22, 2023, under International application No.PCT/JP2023/041956.
Disclaimer: Curated by HT Syndication.
