MUMBAI, India, July 11 -- Intellectual Property India has published a patent application (202541060559 A) filed by Mohan Babu University, Tirupati, Andhra Pradesh, on June 25, for 'coolend pump with heat sinking.'
Inventor(s) include Mr. Dhanireddy Veda Phanindra Reddy; Mr. Kokkanti Giri Prakash; Mr. Vempalli Arif; Ms. Seelam Ankalu Gari Manaswini; Mr. Enugula Dileep Kumar; and Dr. Gurram Sunitha.
The application for the patent was published on July 11, under issue no. 28/2025.
According to the abstract released by the Intellectual Property India: "This invention relates to a dual-drive engine coolant pump assembly that integrates both mechanical and electrical drive systems to enhance engine thermal management and operational efficiency. The assembly includes a pump housing, an impeller-driven pump shaft, an electric motor, a control circuit board, and a clutch mechanism actuated by a solenoid for engagement with an engine-driven pulley. A key innovation is the incorporation of a thermal conduction interface between the motor housing and the circuit board. This interface allows direct heat transfer from the electronic components to the engine coolant, facilitating effective thermal dissipation. By improving heat management, the system increases the reliability and performance of the motor, especially under high-load or idling conditions where electronic components are prone to overheating. Additionally, the assembly features a coolant flow control mechanism that dynamically adjusts circulation based on varying operational states. This ensures the engine operates within optimal temperature ranges across different load conditions. The combination of dual-drive capability and intelligent thermal control contributes to improved fuel efficiency, reduced emissions, and extended component lifespan, making the system ideal for modern internal combustion and hybrid power trains."
Disclaimer: Curated by HT Syndication.
