MUMBAI, India, July 25 -- Intellectual Property India has published a patent application (202411004692 A) filed by Inficold India Private Limited, Hapur, Uttar Pradesh, on Jan. 23, 2024, for 'cooling system with thermal storage and related methods.'
Inventor(s) include Goel, Nitin; Pokharna, Himanshu; Singhal, Aman; Patel, Est Dev; Ravikant; and Tritwal, Ankit.
The application for the patent was published on July 25, under issue no. 30/2025.
According to the abstract released by the Intellectual Property India: "A cooling system 200 includes Thermal Energy Storage (TES) unit 202 connected through heat exchangers to refrigeration unit 204. A first heat exchanger 208A transfers heat from coolant to refrigeration unit 204 positioned in coolant loop upstream of TES unit 202 and downstream of cooled space 206. Consequently, working temperature difference between coolant and heat transfer medium of refrigeration unit 204 is larger. The coolant absorbs heat from cooled space 206 and selectively rejects absorbed heat to refrigeration unit 204, TES unit 202, or both. When low-cost energy is available, coolant charges TES unit 202 and/or cools specified region 206 to be cooled, depending on whether cooling of specified region 206 to be cooled is needed. Embodiments of cooling system 200 can include a by-pass pathway for directing Heat Transfer Fluid (HTF) past space to be cooled when cooling of space 206 to be cooled is not needed."
Disclaimer: Curated by HT Syndication.
