MUMBAI, India, Aug. 22 -- Intellectual Property India has published a patent application (202517072377 A) filed by Sekisui Chemical Co. Ltd., Osaka, Japan, on July 30, for 'curable heat-conductive adhesive agent.'
Inventor(s) include Morimoto, Kohei; Furukawa, Atsushi; Iwamoto, Tatsuya; Yoshioka, Tetsurou; Kobayashi, Yuusuke; and Iino, Tatsuya.
The application for the patent was published on Aug. 22, under issue no. 34/2025.
According to the abstract released by the Intellectual Property India: "A curable heat-conductive adhesive agent according to the present invention contains a curable binder and a heat-conductive filler. A cured product obtained by curing the curable heat-conductive adhesive agent at 60 C for 24 hours has an adhesive strength of 0.3 MPa or more. When the storage modulus and the loss tangent obtained when a dynamic viscoelasticity measurement is performed on the cured product at 25 C at a frequency of 0.1 Hz are denoted as G' and tand, respectively, formula (1) is satisfied. According to the present invention, it is possible to provide a curable heat-conductive adhesive agent capable of forming a heat-conductive member that has high adhesive strength with respect to an adherend, and that is unlikely to be detached from the adherend even after undergoing a cooling/heating cycle between a low temperature and a high temperature. Formula (1): 1og10(G')4.29 tand+6."
The patent application was internationally filed on Jan. 31, 2024, under International application No.PCT/JP2024/003186.
Disclaimer: Curated by HT Syndication.
