MUMBAI, India, July 25 -- Intellectual Property India has published a patent application (202517059962 A) filed by Namics Corporation, Niigata, Japan, on June 23, for 'curable resin composition, adhesive, sealing material, cured product, semiconductor apparatus, and electronic device.'
Inventor(s) include Suzuki Fumiya; and Iwaya Kazuki.
The application for the patent was published on July 25, under issue no. 30/2025.
According to the abstract released by the Intellectual Property India: "Provided are: a curable resin composition which can be cured at low temperatures, from which a cured product having a low Tg can be obtained, and which has excellent conformability to an adherend; an adhesive; a sealing material; a cured product having a low Tg; a semiconductor apparatus including the cured product; and an electronic device including the cured product. The curable resin composition comprises (A) a cationic curable resin, (B) an acid generator including an iodonium salt, and (C) a peroxydicarbonate-type organic peroxide. The component (A) includes at least one selected from the group consisting of (A1) an epoxy resin having a ring skeleton in a molecule, and (A2) an oxetane resin."
The patent application was internationally filed on July 27, 2023, under International application No.PCT/JP2023/027621.
Disclaimer: Curated by HT Syndication.
