MUMBAI, India, May 1 -- Intellectual Property India has published a patent application (202641049835 A) filed by Bapatla Surendra Babu; and Irukumalli Priyanka, Tenali, Andhra Pradesh, on April 19, for 'curvature-activated pressure from strain-tensioned adherend networks apparatus exploiting geometric force resolution.'
Inventor(s) include Bapatla Surendra Babu; and Irukumalli Priyanka.
The application for the patent was published on May 1, under issue no. 18/2026.
According to the abstract released by the Intellectual Property India: "The present invention relates to solid-state mechanics and flexible optoelectronics. A technical problem in foldable displays is catastrophic internal delamination resulting from bending-induced shear stress, typically mitigated by problematic compliant adhesives. The solution is an apparatus that converts tensile bending stress into localized radial clamping force. A multi-layer display stack (130) features layer ordering optimization (150), explicitly positioning high-modulus outer layers (160) at a maximum distance from a neutral bending axis (140). Bonded by high-transmission rigid adhesives (410), folding the stack to a predefined fold radius (120) generates massive tensile bending stress (220). A deterministic force resolution (230) physically resolves this tangential tension through the geometric curvature, generating cumulative radial pressure (240). This massive inward pressure crushes the layers together, establishing a structurally clamped interface (340) that physically opposes micro-crack delamination. The effective adhesion energy scales exponentially via an inverse radius relationship, providing an autonomously strengthening interface without mechanical hinges."
Disclaimer: Curated by HT Syndication.
