MUMBAI, India, July 25 -- Intellectual Property India has published a patent application (202537067536 A) filed by Kabushiki Kaisha F. C. C., Shizuoka, Japan, on July 15, for 'die-casting die.'
Inventor(s) include Shiozaki Masatoshi.
The application for the patent was published on July 25, under issue no. 30/2025.
According to the abstract released by the Intellectual Property India: "A die casting mold 10 includes a first insert 50 positioned on a fixed mold 20 side, and a second insert 70 positioned on a movable mold 30 side, wherein: the first insert 50 has first through-holes 56 which, by being filled with molten metal material, mold a plurality of pins 105 for heat dissipation; the second insert 70 has second through-holes 76 for releasing gas inside a molding space 15; recessed grooves 80 that communicate with the first through-holes 56 and the second through-holes 76 when the first insert 50 and the second insert 70 are arranged, and through which the molten metal material cannot pass but the gas can pass, are formed in at least one of a first opposing surface 53 and a second opposing surface 73; and when viewed from a mold movement direction P, the plurality of first through-holes 56 do not overlap at least some of the plurality of second through-holes 76."
The patent application was internationally filed on Jan. 16, 2024, under International application No.PCT/JP2024/000948.
Disclaimer: Curated by HT Syndication.
