MUMBAI, India, July 25 -- Intellectual Property India has published a patent application (202547067883 A) filed by Henkel Ag & Co. Kgaa, Duesseldorf, Germany, on July 16, for 'dually curable adhesive composition.'
Inventor(s) include Li, Minrui; Zhang, Xiaoke; Wang, Yongxia; Qi, Zhanzheng; and Du, Qing.
The application for the patent was published on July 25, under issue no. 30/2025.
According to the abstract released by the Intellectual Property India: "The present invention provides a dually curable adhesive composition comprising (A) at least one isocyanate-terminated polyurethane prepolymer, (B) at least one radical polymerizable compound, (C) at least one photoinitiator, and (D) at least one moisture curing catalyst, wherein the composition after UV radiation with a wavelength of 375nm and intensity of 50mW/cm 2 for 60 seconds, has a loss factor value larger than 0.6, as measured at room temperature in accordance with ASTM D4440-15."
The patent application was internationally filed on Dec. 22, 2022, under International application No.PCT/CN2022/141155.
Disclaimer: Curated by HT Syndication.
