MUMBAI, India, Jan. 23 -- Intellectual Property India has published a patent application (202511122706 A) filed by Uflex Limited, New Delhi, on Dec. 5, 2025, for 'easy-to-tear & heat sealable flexible packaging laminate and film.'
Inventor(s) include Chaturvedi, Ashok; Chaturvedi, Anantshree; Sirsamkar, Pramod Laxmikantrao; and Ram Gopal.
The application for the patent was published on Jan. 23, under issue no. 04/2026.
According to the abstract released by the Intellectual Property India: "A flexible packaging laminate (200) is disclosed, comprising a polymeric packaging film (100) including a base layer (101) having a top surface (102) and a bottom surface (103), with the top surface (102) provided with micro-indentations (104) that are not through-holes. A primer coating (108) is applied over the top surface (102), and an acrylic coating (110) is applied over the primer coating (108). An aluminium foil (202) is laminated to the bottom surface (103) of the base layer (101), forming a multilayer laminate with enhanced adhesion and functional performance."
Disclaimer: Curated by HT Syndication.
