MUMBAI, India, Nov. 14 -- Intellectual Property India has published a patent application (202547097203 A) filed by Te Connectivity Solutions Gmbh, Schaffhausen, Switzerland, on Oct. 8, for 'electrical contact with textured contact interface.'
Inventor(s) include Klinger, Brian Todd; Deshmukh, Ranjan Deepak; Bhargava, Suvrat; and Gingrich III, Charles R.
The application for the patent was published on Nov. 14, under issue no. 46/2025.
According to the abstract released by the Intellectual Property India: "An electrical contact having at least one textured contact interface. The at least one textured contact interface includes a radiused portion with a plurality of raised contact areas. Voids are positioned between the plurality of raised contact areas. The radiused portion of the at least one textured contact interface provides more than one point of contact when the radiused portion of the at least one textured contact interface is positioned in electrical engagement with a mating electrical contact."
The patent application was internationally filed on Mar. 14, 2024, under International application No.PCT/IB2024/052493.
Disclaimer: Curated by HT Syndication.
