MUMBAI, India, June 20 -- Intellectual Property India has published a patent application (202414092384 A) filed by Kistler Holding Ag, Winterthur, Switzerland, on Nov. 26, 2024, for 'electromechanical joining module.'
Inventor(s) include Jochen Schneider; and Stanko Tepsic.
The application for the patent was published on June 20, under issue no. 25/2025.
According to the abstract released by the Intellectual Property India: "Summary The invention relates to an electromechanical joining module for applying a force; with a tappet; with a force transducer, which is attached to the tappet and measures the applied force and generates measured values for the measured force,; which tappet and which force transducer can be moved relative to a stator over a stroke length in a linear manner; which tappet comprises tappet electronics and a tappet coil; which stator comprises stator electronics and a stator coil; which tappet coil remains in a close arrangement with respect to the stator coil in the course of linear movement; which tappet electronics and which stator electronics are suitable for transmitting the measured values as measured data from the tappet coil to the stator coil by near-field telemetry; wherein the stator coil extends over the entire stroke length."
Disclaimer: Curated by HT Syndication.
