MUMBAI, India, June 6 -- Intellectual Property India has published a patent application (202311081224 A) filed by Hero Motocorp Limited, New Delhi, on Nov. 30, 2023, for 'electronic component accommodating structure.'
Inventor(s) include Goyal, Ashish.
The application for the patent was published on June 6, under issue no. 23/2025.
According to the abstract released by the Intellectual Property India: "The present invention relates an electronic component accommodating structure (100) of a vehicle (10) for accommodating an electronic component (50) of the vehicle (10), the electronic component accommodating structure (100) adaptable to be disposed over a first aperture (52) of a body cover (54) of the vehicle (10), the electronic component accommodating structure (100) comprises a top wall (102) overlapping with the first aperture (52), the top wall (102) comprises an anti-rattling portion (104); at least one bottom wall (108) opposite to the anti-rattling portion (104), the at least one bottom wall (108) comprising a channel (112) terminating at a second aperture (114); and at least one vertical wall (106) connected in between the top wall (102) and the at least one bottom wall (108) for defining an accommodating space (110)."
Disclaimer: Curated by HT Syndication.
