MUMBAI, India, Nov. 14 -- Intellectual Property India has published a patent application (202517095794 A) filed by Samsung Electronics Co. Ltd., Gyeonggi, Republic of Korea, on Oct. 6, for 'electronic device comprising deformable printed circuit board.'
Inventor(s) include Lee, Youngsun; Kim, Byeongkeol; Ra, Jaeyeon; and Lee, Seungjoo.
The application for the patent was published on Nov. 14, under issue no. 46/2025.
According to the abstract released by the Intellectual Property India: "An electronic device according to an embodiment comprises: a first housing; a second housing; a hinge structure that movably connects the first housing and the second housing; and a first printed circuit board having at least a portion deformable according to a movement of the second housing with respect to the first housing, wherein the first printed circuit board comprises: a first conductive layer; a second conductive layer arranged on the first conductive layer; at least one conductive via extending from the first conductive layer to the second conductive layer; a radiating layer interposed between the first conductive layer and the second conductive layer and comprising an opening that surrounds the at least one conductive via; and a non-conductive layer having at least a portion arranged in the opening."
The patent application was internationally filed on Feb. 13, 2024, under International application No.PCT/KR2024/002046.
Disclaimer: Curated by HT Syndication.
