MUMBAI, India, July 5 -- Intellectual Property India has published a patent application (202517059313 A) filed by Samsung Electronics Co. Ltd., Gyeonggi, Republic of Korea, on June 20, for 'electronic device comprising structure for shielding printed circuit board including connector.'
Inventor(s) include Nam, Daehee; Ko, Myungsub; Seo, Wonho; and Choi, Dongkil.
The application for the patent was published on July 4, under issue no. 27/2025.
According to the abstract released by the Intellectual Property India: "An electronic device according to one embodiment comprises: a support member; an electronic component; a first printed circuit board; a first connector; a second printed circuit board including a first portion disposed between the support member and the first printed circuit board, a second portion on which the electronic component is disposed, and a third portion extending from the first portion to the second portion; a second connector disposed on the first portion; a shielding wall protruding from a side of the support member facing the first printed circuit board and surrounding at least a portion of the first portion; and a shielding member surrounding at least a portion of the electronic component, wherein a portion of the shielding member overlaps with the first printed circuit board."
The patent application was internationally filed on Nov. 09, 2023, under International application No.PCT/KR2023/018006.
Disclaimer: Curated by HT Syndication.
