MUMBAI, India, Nov. 14 -- Intellectual Property India has published a patent application (202547097014 A) filed by Te Connectivity Solutions Gmbh, Schaffhausen, Switzerland, on Oct. 8, for 'ground shield contact member.'
Inventor(s) include Walton, Scott Eric; Annis, Kyle Gary; Miller, Keith Edwin; Tuin, Jacobus Nicolaas; Smink, Rutger Wilhelmus; Floris, Sander Johannes; Champion, Bruce Allen; and Gingrich III, Charles Raymond.
The application for the patent was published on Nov. 14, under issue no. 46/2025.
According to the abstract released by the Intellectual Property India: "An electrical connector with a housing having at least one slot for receiving an electrical wafer therein. Signal contacts are positioned on a first side of the at least one slot. The signal contact resilient contact arms exert a first normal force on the electrical wafer inserted in the at least one slot. At least one ground shield contact member is positioned on a second side of the at least one slot. The ground shield resilient contact arms exert a second normal force on the wafer inserted in the at least one slot. The second normal force exerted by the ground shield resilient contact arms is greater than the first normal force exerted by the signal contact resilient contact arms. The wafer is biased toward the signal contact resilient contact arms of the signal contacts regardless of a thickness of the wafer."
The patent application was internationally filed on Mar. 14, 2024, under International application No.PCT/IB2024/052491.
Disclaimer: Curated by HT Syndication.
