MUMBAI, India, Oct. 31 -- Intellectual Property India has published a patent application (202547093822 A) filed by Matsumoto Yushi-Seiyaku Co. Ltd., Osaka, Japan, on Sept. 30, for 'heat-expandable microspheres and use thereof.'
Inventor(s) include Meshizuka, Tomohiro.
The application for the patent was published on Oct. 31, under issue no. 44/2025.
According to the abstract released by the Intellectual Property India: "The purpose of the present invention is to provide heat-expandable microspheres capable of yielding a molded article that does not tend to deform over the long term, and the use of the heat-expandable microspheres. The present invention is heat-expandable microspheres comprising a shell that contains a thermoplastic resin and a foaming agent that is encapsulated in the shell and that vaporizes upon heating, wherein the thermoplastic resin is a polymer of a polymerizable component comprising at least one selected from carboxyl group-containing monomers, (meth)acrylic acid ester monomers, styrene monomers, and (meth)acrylamide monomers, the recovery efficiency after compression when heated for two minutes at a temperature 20 C lower than the maximum expansion temperature of the heat-expandable microspheres is from more than 0 to 3.5, and the compression recovery when heated for two minutes at a temperature 20 C lower than the maximum expansion temperature of the heat-expandable microspheres is 65% or more."
The patent application was internationally filed on Feb. 21, 2024, under International application No.PCT/JP2024/006163.
Disclaimer: Curated by HT Syndication.
