MUMBAI, India, June 6 -- Intellectual Property India has published a patent application (202517011393 A) filed by Lg Energy Solution, Ltd., Seoul, Republic of Korea, on Feb. 11, for 'heat sink assembly.'
Inventor(s) include Hur, Nam Hoon; Shin, Ju Hwan; and Lee, Hyoung Suk.
The application for the patent was published on June 6, under issue no. 23/2025.
According to the abstract released by the Intellectual Property India: "The disclosed heat sink assembly comprises, as an example: a heat sink having a plurality of ribs integrally formed along the inner longitudinal direction by extrusion molding, the space between the ribs forming a channel, and first and second surfaces at both ends thereof in the longitudinal direction being opened; and a pair of end plugs for closing the first and second surfaces at both ends of the heat sink. The ribs of the heat sink comprise: a center rib, one end of which is near the first surface side is closed, and the other end of which is near the second surface side is open, with respect to the pair of end plugs; and a side rib disposed on at least one side with respect to the center rib, both ends of the side rib near the first and second surface being open."
The patent application was internationally filed on May 27, 2024, under International application No.PCT/KR2024/007136.
Disclaimer: Curated by HT Syndication.
