MUMBAI, India, July 5 -- Intellectual Property India has published a patent application (202311086909 A) filed by Chairman, Defence Research & Development Organisation, New Delhi, on Dec. 19, 2023, for 'high temperature composite and process for preparation thereof.'
Inventor(s) include Ivaturi, Srikanth; Ponnusamy, Selvam; Sidhanshu, Pradip Khursange; Mondal, Samar; Daniel, Alex; Ghosal, Ananya; Khaire, Manish Chandrakant; Kamalakar, Toopu; and Kumar, Anil.
The application for the patent was published on July 4, under issue no. 27/2025.
According to the abstract released by the Intellectual Property India: "The present disclosure relates to a high temperature carbon-silica-carbon/carbon-alumina-carbon composite laminate comprising: a reinforced preform is made up of carbon fabrics arranged in the form of preform by stacking and sticking them in the third direction using carbon fibers, a primary matrix layer made up of silica/alumina, encapsulating the preform and a secondary matrix made of carbon, encapsulating the primary matrix. Further, the present application relates to a method for preparing a high temperature composite. The composite shows mechanical properties up to 100MPa at 1250 C and conductivity of around 2 W/m-K. The composite material can be easily cut with hand held cutting tools which makes it suitable to realize any shape or structure. Further, the process adopted is suitable to realise large size airframe sections for aerospace vehicles which need to cruise for long durations at high mach numbers."
Disclaimer: Curated by HT Syndication.
