MUMBAI, India, July 5 -- Intellectual Property India has published a patent application (202517054856 A) filed by Corning Incorporated, Corning, U.S.A., on June 6, for 'hybrid systems and methods for characterizing stress in chemically strengthened transparent substrates.'
Inventor(s) include Andrews, Ryan Claude; Berg, David Matthew; Bouzi, Pierre Michel; Furnas, William John; Gee, Christopher David; Immerman, Jacob; Lindstrand, Andrew Allen; Newcomer, Glenn Abram; Olson, Evan Lewis; Turnbull, IV, Melbourne Thompson; and Wetmore, Nathaniel David.
The application for the patent was published on July 4, under issue no. 27/2025.
According to the abstract released by the Intellectual Property India: "A scattered light polarimetry (LSP) sub-system of a hybrid system for characterizing stress in a chemically-strengthened (CS) substrate having a top-surface and a near-surface waveguide, includes a LSP light source system, an LSP light source actuator coupled to the LSP light source system, and an optical compensator within an optical path of a LSP laser beam emitted by the LSP light source system. The optical compensator includes a half-wave plate, a half-wave plate actuator, a diffuser, and a diffuser actuator. The LSP sub-system further includes a LSP detector system in optical communication with the optical compensator through an LSP coupling prism having a LSP coupling surface, a focusing lens and a focusing lens actuator, and a support plenum having a surface and a measurement aperture, the support plenum configured to support the CS substrate at a measurement plane at the measurement aperture, and to operably support the LSP coupling prism."
The patent application was internationally filed on Nov. 27, 2023, under International application No.PCT/US2023/081064.
Disclaimer: Curated by HT Syndication.
