MUMBAI, India, June 27 -- Intellectual Property India has published a patent application (202321088094 A) filed by Indian Institute Of Technology, Gandhinagar, Gujarat, on Dec. 22, 2023, for 'hydrogel flap for wound healing and method of fabrication thereof.'
Inventor(s) include Mukesh Dhanka; Hitasha Vithalani; and Harshil Dave.
The application for the patent was published on June 27, under issue no. 26/2025.
According to the abstract released by the Intellectual Property India: "The present disclosure relates to a hydrogel flap designed for accelerated wound healing. The hydrogel flap comprises a base material a crosslinking agent that enhances the mechanical strength and stability of the therapeutics-encapsulated hydrogel flap, and an adhesive layer made of poly-methyl vinyl ether-alt-maleic acid (PMVE/MA) integrated into the said base material. The hydrogel flap of the present disclosure further comprises an antibiotic embedded within the base material. The present disclosure also provides a method for its preparation. The hydrogel flap of the present disclosure exhibits enhanced mechanical strength, stretchability, and stability targeted for wounds occurring in dynamic and high-stress-bearing areas of the body. The hydrogel flap has antibacterial properties for infection control and is biodegradable."
Disclaimer: Curated by HT Syndication.
