MUMBAI, India, June 6 -- Intellectual Property India has published a patent application (202517021822 A) filed by Sentea, Gent, Belgium, on March 11, for 'improved light source integration.'
Inventor(s) include Spuesens Thijs; Bockstaele Ronny; and Verhaegen Karsten.
The application for the patent was published on June 6, under issue no. 23/2025.
According to the abstract released by the Intellectual Property India: "The invention provides amongst other aspects a silicon on insulator SOI device for receiving a light source device in a flip chip arrangement the device comprising from bottom to top: a support layer; a BOX buried oxide layer comprising BOX material; a BOX covering layer comprising a selective etch stop material; a cladding oxide layer comprising a light interface; wherein the device comprises a plurality of recesses extending between the support layer and the BOX covering layer said recesses defining a pocket for said receiving of the light source device and a plurality of pedestals; wherein at least one of the pedestals is provided at a side of the pocket that is opposite with respect to another one of the pedestals; wherein the pedestals each extend between the support layer and the BOX covering layer thereby comprising a top portion comprising preferably consisting of said selective etch stop layer material."
The patent application was internationally filed on Aug. 04, 2023, under International application No.PCT/EP2023/071686.
Disclaimer: Curated by HT Syndication.
