MUMBAI, India, Sept. 12 -- Intellectual Property India has published a patent application (202411012198 A) filed by Rajan Kapoor, New Delhi, on Feb. 21, 2024, for 'improved wire tensioning systems.'
Inventor(s) include Rajan Kapoor.
The application for the patent was published on Sept. 12, under issue no. 37/2025.
According to the abstract released by the Intellectual Property India: "The present invention provides an improved wire tensioning system that allows for attaching/removing a cable as easily and quickly as possible, while being safe as well, the wire tensioning systems being for supporting various structures. According to an embodiment, the improved wire tensioning system comprises at least one cable gripper attached to at least one existing turnbuckle that is to be installed for wire tensioning for supporting various structures."
Disclaimer: Curated by HT Syndication.
