Intellectual Property India Publishes Patent Application for 'In-Mold Sealing System To Assist With Vacuum Assisted Resin Transfer Molding' Filed by Tpi Technology, Inc.

MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517039389 A) filed by Tpi Technology, Inc., Scottsdale, U.S.A., on April 24, for 'in-mold sealing system to assist with vacuum assisted resin transfer molding.'

Inventor(s) include Salimi, Amirhossein; and Segala, Alexander.

The application for the patent was published on June 13, under issue no. 24/2025.

According to the abstract released by the Intellectual Property India: "An in-mold sealing system for sealing openings in a wind turbine blade mold, the system including a wind turbine blade mold having an interior surface configured to form a surface of the wind turbine blade, the interior surface of the mold having at least one opening therein, at least one boss disposed within the at least one opening of the mold, the boss extending a distance beyond the interior surface of the mold, a flexible diaphragm having opposing first and second surfaces, with the first surface facing the mold, the flexible diaphragm disposed over the opening in the mold surface and a gasket, the gasket having a first surface coupled to a perimeter portion of the flexible diaphragm, and a second surface coupled to the interior surface of the mold, wherein the gasket circumscribes the opening."

The patent application was internationally filed on Oct. 19, 2023, under International application No.PCT/US2023/035488.

Disclaimer: Curated by HT Syndication.