MUMBAI, India, Nov. 14 -- Intellectual Property India has published a patent application (202517096941 A) filed by Dic Corporation, Tokyo, on Oct. 8, for 'ink composition for flexible packaging laminates, printed matter, laminate, or package.'
Inventor(s) include Aoki Ruri; Asami Tomomi; Uchida Shuma; and Egawa Kentaro.
The application for the patent was published on Nov. 14, under issue no. 46/2025.
According to the abstract released by the Intellectual Property India: "The present disclosure provides an ink composition for flexible packaging laminates which is able to form ink layers excellent in terms of flowability, adhesion, blocking resistance, peel strength, and dry laminate strength. The ink composition for flexible packaging laminates contains a urethane resin (A) having a number-average molecular weight of 1,000-3,000 and formed using, as reaction starting materials, an organic diisocyanate compound (a1) and a polyol (a2) having a number-average molecular weight (Mn) of 700-900."
The patent application was internationally filed on Apr. 26, 2024, under International application No.PCT/JP2024/016603.
Disclaimer: Curated by HT Syndication.
