MUMBAI, India, July 25 -- Intellectual Property India has published a patent application (202547067855 A) filed by Qualcomm Incorporated, San Diego, on July 16, for 'integrated device comprising an inductor and a patterned shield structure.'

Inventor(s) include Yen, Hsiao-Tsung; Hua, Xingyi; and Kim, Jeongil Jay.

The application for the patent was published on July 25, under issue no. 30/2025.

According to the abstract released by the Intellectual Property India: "An integrated device comprising a die substrate, a die interconnection portion coupled to the die substrate, an inductor, and a shield structure. The shield structure comprises a shield frame and a plurality of shield branches coupled to the shield frame, wherein at least one shield branch from the plurality of shield branches comprises a repeating wave shape."

The patent application was internationally filed on Mar. 07, 2024, under International application No.PCT/US2024/018899.

Disclaimer: Curated by HT Syndication.